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PCBs are widely used in automotive electronics, including power control systems, safety control systems, body electronics systems, and entertainment communication systems. Therefore, the requirements for PCBs are diversified, and products with large quantities and low prices are highly reliable. Sexual needs coexist. New energy vehicles: The value of a single vehicle PCB brought by the vehicle controller (VCU), motor controller (MCU) and battery management system (BMS) of new energy vehicles has increased by more than 2,000 yuan, which greatly exceeds the advantages of intelligence and lightweight. increase in coming. Autonomous driving: The commercialization of autonomous driving will also open up a broad space for automotive PCBs; with the development of autonomous driving technology, ADAS applications of varying degrees are infiltrating, which will also open up a broad growth space for automotive PCBs. Therefore, under the trend of automotive electronics, the rapid development of new energy vehicles and the gradual improvement of autonomous driving technology, the demand for PCBs in the automotive electronics field will usher in a release period.
2.5G technology development promotes PCB technology progress
5G high-frequency technology places higher requirements on circuits. Radio frequency circuits with operating frequencies above 1GHz are generally referred to as high-frequency circuits. In the process of mobile communication from 2G to 3G and 4G, the communication frequency band has developed from 800MHz to 2.5GHz. In the 5G era, the communication frequency band will be further improved. The PCB board will be equipped with antenna oscillators, filters and other devices in terms of 5G radio frequency. In order to meet the needs of high frequency and high speed, and to deal with the problems of poor millimeter wave penetration and fast attenuation, 5G communication equipment has the following three performance requirements for PCB: (1) low transmission loss; (2) low transmission delay; (3) Precision control of high characteristic impedance. The substrate material that meets the high frequency application environment is called high frequency copper clad laminate. There are mainly two indicators of dielectric constant (Dk) and dielectric loss factor (Df) to measure the performance of high-frequency copper clad laminate materials. The smaller the Dk and Df, the more stable, and the better the performance of high-frequency and high-speed substrates. In addition, in terms of RF boards, PCB boards have a larger area and more layers, which require higher heat resistance (Tg, high temperature modulus retention) and tighter thickness tolerances of the substrate.
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